Title

Circuit Assembly and Connection Processes for LASER Printing

The present project aims at the development of new processes for the assembly and the wire bonding of electronic circuits with digital laser printing and sintering technology. In order to integrate them into industrial processes of packaging and production of electronic circuits, the packaged integrated circuits which will be achieved by laser printing will undergo the assembly process also with laser printing in order to demonstrate fully functional electronic circuits with contact sizes smaller than the current limit of the surface mount technology. During the project, printable materials with silver and copper nanoparticles will be designed, manufactured and characterized by two project partners, until their properties are optimized for high-conductivity and high mechanical strength interconnections. The proposed technological breakthrough lies in the increase of the printing speed and reasolution of electronic circuit assembly and wirebonding, and will be a valuable innovation for the field of microelectronic.